This cable assembly features a slim form factor design, capable of transmitting high-speed signals up to PCIe Gen 6 and enabling much longer signal paths with superior SI performance compared to conventional PCB routing methods. It also supports a modular design for future expansion, including both power and high/low-speed signal transmission.
This MCIO cable assembly features a slim form factor design, capable of transmitting high-speed signals up to PCIe Gen 4 and PCIe Gen 5 standards. It allows for extended signal path lengths while maintaining superior signal integrity (SI) performance compared to conventional PCB routing methods. Additionally, JPC offers a variety of transmission channel options to suit different application needs.
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