Overview/Description
The EDSFF cable assembly is a high-density, modular interconnect solution designed to provide flexibility and signal integrity for high-speed signaling. It supports SI performance up to PCIe Gen 4 and Gen 5, with multiple channel options available, including 1C, 2C, 4C, and 4C+. Customization options are also offered to meet specific requirements.
Specifications
• Pitch(mm): 0.6
• Number of Contacts : 84
• Gender: Receptacle
• Termination Interface: Solder For Cable
• Current-Maxinum per contact: 1.1A per contact MAX.
• AC Durability: 200 Cycles
• Plating Contact area: See Customer Drawing
• Temperature Range - Operating: -40°C to +85°C
Applications
Target Markets
Storage Server, Workstation
AI/GPU Server
High-Performance Computing (HPC)
